Enterprise PCIe Tech Notes

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
The SMART Command Feature Set:  TN-FD-03: The SMART Command Feature Set TN-FD-03 09/2010 485.87 KB

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