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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
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TN-00-15
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03/2007
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69.09 KB
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Technical Note
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Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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428.33 KB
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Technical Note
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Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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1.52 MB
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Technical Note
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2010
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87.26 KB
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Technical Note
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Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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206.91 KB
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Technical Note
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Introduction to On-Board Programming with Numonyx Flash Memory:
This application note describes the strengths, limitations, programming methods, and design considerations for on-board programming of NOR Flash memory devices.
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AN-624
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11/2010
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87.42 KB
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Technical Note
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Simplify Manufacturing by Using Automatic-Test-Equipment for On-Board Programming:
This document describes using automatic-test-equipment (ATE) to program Numonyx NOR Flash memory components on a PCB.
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AN-629
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11/2010
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440.67 KB
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Technical Note
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How to Migrate from the M95 SPI EEPROM to the M25PE SPI Serial Flash:
This application note describes how to migrate from the M95 family of SPI EEPROMs to the M25PE family of SPI Serial Flash memories.
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AN-2081
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11/2010
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314.02 KB
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Technical Note
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Using XIP Modes in the Forte N25Q Flash Memory Device:
This technical note explains how to implement eXecute in Place (XiP) functionality in an application based on the Numonyx Forte N25Q Flash memory device family.
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TN-12-07
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04/2011
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213.9 KB
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Technical Note
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How to Migrate from Numonyx M25P128 130nm to 65nm Serial Flash:
This application note explains how to migrate an application based on the Numonyx M25P128 (130nm) to Numonyx M25P128 (65nm) serial Flash memory device.
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AN-309026
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11/2010
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49.9 KB
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Technical Note
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Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
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11/2010
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66.13 KB
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Technical Note
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Comparing Micron N25Q and Winbond W25Q Flash Devices:
Tech Note Comparing Micron N25Q and Winbond W25Q Flash Devices
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TN-12-17
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07/2011
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201.88 KB
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Technical Note
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Comparing Micron N25Q and SST SST26WF Flash Devices:
Tech Note Comparing Micron N25Q and SST SST26WF Flash Devices
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TN-12-16
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07/2011
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191.82 KB
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Technical Note
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Comparing Micron N25Q and Spansion S25FL Flash Devices:
Technical Note Comparing Micron N25Q and Spansion S25FL Flash Devices
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TN-12-15
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07/2011
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197.96 KB
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Technical Note
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Comparing Micron N25Q and Macronix MX25L Flash Devices:
Technical Note Comparing Micron N25Q and Macronix MX25L Flash Devices
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TN-12-14
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07/2011
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203.35 KB
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Technical Note
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Comparing Micron N25Q and M25PX Flash Devices:
Tech Note Comparing Micron N25Q and M25PX Flash Devices
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TN-12-13
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07/2011
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187.87 KB
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Technical Note
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Comparing Micron N25Q and M25P Flash Devices:
Tech Note Comparing Micron N25Q and M25P Flash Devices
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TN-12-12
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07/2011
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194.67 KB
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Technical Note
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Migrating from Atmel AT45DB011D to Micron M45PE10 Flash Devices:
This technical note describes the process for migrating from the Atmel Serial NOR Flash Memory device (AT45DB011D) to the Micron Serial NOR Flash memory device (M45PE10).
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TN-12-09
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05/2011
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198.99 KB
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Technical Note
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Migrating N25Q 3V, 128Mb Device:
This technical note explains how to migrate from the Micron® N25Q 3V, 128Mb parameter blocks serial NOR Flash device to the N25Q 3V, 128Mb uniform, subsector erase serial NOR Flash device.
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TN-12-10
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06/2011
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244.77 KB
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Technical Note
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Migrating from Macronix MX25L25635E to Micron N25Q 256Mb Flash:
Compares the features of the Macronix MX25L25635E and Micron N25Q (256Mb)Flash memory devices.
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TN-12-18
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12/2011
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226.89 KB
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Technical Note
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Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
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TN-00-06
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03/2011
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481.9 KB
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Technical Note
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Password Protecting Flash Memory Blocks:
This document describes a method of password protecting blocks using Micron's M29EW device as an example.
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TN-12-05
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03/2011
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404.22 KB
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Technical Note
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Software Device Drivers for Micron's N25Q Serial NOR Flash Memory:
This technical note provides a description of the C library source code for Micron N25Q serial NOR Flash memory devices.
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TN-12-11
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02/2012
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413.05 KB
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Technical Note
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Migrating from Spansion's S25FL256S to Micron's N25Q 256Mb Flash:
Compares features of Micron's 256Mb N25Q and Spansion's S25FL256S Flash memory devices
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TN-12-19
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04/2012
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243.96 KB
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Technical Note
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Migrating from Macronix's MX25L25635F to Micron's N25Q 256Mb Flash Device:
Migrating from Macronix's MX25L25635F to Micron's N25Q 256Mb Flash Device
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TN-12-20
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05/2012
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254.43 KB
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Technical Note
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