e-MMC

Targeting Mobile Multimedia Applications

Our e·MMC™ embedded memory combines a high-capacity NAND Flash memory device with a high-speed, MultiMediaCard (MMC) controller in a single package. Find out how you can get the performance and reliability you need and still get to market quickly using this cost-effective embedded memory.

NAND Flash for Mobile Multimedia

Superior Mass Storage
Our e·MMC embedded memory combines high-quality, low-cost NAND Flash memory with a high-speed, JEDEC-compliant MultiMediaCard (MMC) controller in a single, low-profile BGA package. The single-package solution is a great choice for designers who are looking for MMC-like, application-to-application interoperability. And because we manufacture the NAND, we can offer e·MMC solutions in a variety of densities and options; contact us for inquiries and more information.

e·MMC Documentation

e·MMC Technical Notes

Easy to Design In
Our e·MMC embedded memory essentially transforms a program/erase/read device like NAND Flash into a simple write/read memory. This managed interface addresses potential NAND design concerns internally, using error correction code (ECC), wear leveling, and bad block management technology. Handling errors internally takes the burden off the host controller and increases speed, providing higher system performance.

Streamlined Development and Qualification
e·MMC embedded memory also simplifies hardware and software integration by providing a standard interface specification that minimizes the need for host software to accommodate process node migrations and vendor-specific NAND Flash characteristics. It’s a consistent, technology-independent solution that streamlines the development and qualification process and alleviates complexities of designing in current and future NAND devices.

Other Key Benefits

Smooth Transition to MLC
Provides a seamless transition from SLC NAND to MLC NAND.

Easy-to-Use BGA Package
Saves significant resources that would otherwise go to hardware and software development.

High-Performance Controller
Removes the burden of several low-level tasks from the processor.

Standard Interface Specification
Supported by major mobile customers and enablers and compliant with the MMC specification.

Features		Benefits
Package	JEDEC-standard, compliant with the MMC specification	Eases the design and validation process
Voltage	1.8V Vcc (1.8V I/O)	Low voltage extends battery life in mobile devices
Voltage	1.8V Vcc (1.8V I/O)	Low voltage extends battery life in mobile devices
Densities	4GB–32GB	Wide density range
Speed	High speed: up to 52 MB/s	Provides higher system performance
Temperature Ranges	25°C to +85°C	Ideal for rugged environments
Temperature Ranges	-40C to +85C	Ideal for rugged environments
Internal Error Correction	ECC	Takes the burden off host controller and increases speed

Simplifying High-Capacity Storage for Mobile and Embedded Systems
Our e·MMC embedded memory simplifies high-capacity storage issues and eases the load that many wireless processors carry in mobile designs. It also capitalizes on MLC strengths, improving overall system-level performance. Find out how in our e·MMC white paper.
Download the white paper

Choosing the Right NAND
Understanding the advantages that each of the various NAND Flash memory types offers is important if you’re going to find the best possible solution for your application. To help, we’ve developed a Choosing the Right NAND guide, which offers a basic overview of the various NAND Flash options, enumerating the features and benefits of each.
View the guide

Title & Description	ID#	Updated	Size
MCP Product Flyer: 4 reasons why Micron's MCPs are a perfect match		2/2009	255KB
e·MMC Embedded Memory Flyer: Discusses how e·MMC embedded memory works, the e·MMC 4.4 specification, features, benefits, and applications.		6/2009	161KB
Bypass Capacitor Selection for High-Speed Designs: Describes bypass capacitor selection for high-speed designs.	TN-00-06	12/2009	490KB
IBIS Behavioral Models: Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.	TN-00-07	11/2009	168KB
Thermal Applications: Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature	TN-00-08	5/2010	258KB
Recommended Soldering Parameters: Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.	TN-00-15	3/2007	71KB
Uprating of Semiconductors for High-Temperature Applications: Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications	TN-00-18	5/2010	439KB
Understanding Signal Integrity: Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life	TN-00-20	12/2009	2MB
MCP/PoP Part Numbering System: Part numbering guide for Micron MCP/PoP products.		5/2009	29KB
Product Marks/Product and Packaging Labels: Explains product part marking, and product and packaging labels.	CSN-11	2/2010	580KB
PCN/EOL Systems: Explains Micron's product change notification and end-of-life systems.	CSN-12	8/2009	77KB
Bare Die SiPs and MCMs: Describes design considerations for bare die SiPs and MCMs.	CSN-18	4/2009	155KB
Shipping Quantities: Provides tables of part quantity.	CSN-04	3/2010	515KB
Micron Component and Module Packaging: Explanation of Micron packaging labels and procedures.	CSN-16	3/2010	833KB
ESD Precautions for Die/Wafer Handling and Assembly: Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.	CSN-24	8/2010	122KB
Electronic Data Interchange: Describes EDI transmission sets, protocol, and contacts.	CSN-06	9/2005	55KB
RMA Procedures for Packaged Product and Bare Die Devices: Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.	CSN-07	8/2004	52KB
Environmental Programs: Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.	CSN-05	6/2004	55KB
ISO System Management Standards: Describes ISO system management standards.	CSN-08	4/2004	40KB
Avoid Counterfeit Products: Highlights Micron-guaranteed products and how to buy genuine Micron products.		3/2010	201KB

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We have an MMC host controller which supports v4.1 or earlier. Can we use a v4.2 e·MMC device?: Yes, if the device density is up to 2GB. However, for 4GB and higher densities, you need to have the v4.2 MMC driver software in your system, because the device uses sector address mode which is defined in the v4.2 specification.
We have an SD/MMC card socket but don’t have a BGA socket to evaluate an e·MMC device. Can we evaluate a Micron e·MMC device?: Yes, Micron can provide a small board with a mounted BGA device that can fit into an SD/MMC standard card socket for use in evaluation.
Does Micron e·MMC support SPI mode?: Unfortunately, Micron e·MMC does not support SPI mode. The JEDEC e·MMC standard specification removed this functionality from the v4.3 specification.
What is the purpose of R_OD resister? Why do we need to prepare R_OD and R_CMD on command line?: R_OD resister is only used during the card identification period to support 400 kHz clock operation. During this period, the device uses an open drain driver which does not have pull-up capability. The host needs to have strong pull-up capability to operate the command line at 400 kHz. This must be disconnected after the card identification period. R_CMD is used to keep the command line high when there is no transaction on the command line. If the host does not have R_OD, the R_CMD can be used instead. However, the maximum operating frequency during the card identification mode must be reduced.
Is v4.4 e·MMC function backward compatible to v4.2 function?: Yes, v4.4 function is backward compatible to v4.2 function. The v4.2 MMC host can use the v4.4 e·MMC device with v4.2 functionality. The v4.4 device has several additional features which are suitable for secure boot applications from e·MMC devices.

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e-MMC

Targeting Mobile Multimedia Applications

NAND Flash for Mobile Multimedia

e·MMC Documentation

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ON-LINE NONDISCLOSURE AGREEMENT

e-MMC

Related Information

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