Our VLP RDIMMs use up to 67% less board space than standard modules, making your design more compact, slashing thermal power consumption by improving airflow, and delivering the performance you need
More Compact Servers
Data centers are becoming increasingly more expensive, so fitting more servers
into less space is vitally important. Our VLP RDIMMs take up less room on a
board. Certainly, memory isn't the only component that contributes to a server's
size, but designing in VLP RDIMMs helps save valuable space and money.
Better Airflow Saves Power
According to a study from the U.S. Environmental Protection Agency, keeping
servers cool requires about 30 billion kWh annually in the United States alone.
Improved airflow in servers could reduce cooling costs, saving data centers
tens of millions of dollars, euros, pounds, and yen each year. Our VLP RDIMMs
fit vertically on the board, which facilitates better airflow and increases
reliability in heat-sensitive systems.
Vertically Mounted Modules for Better Airflow
Click the play button below to view how VLP memory modules save board space and improve airflow.
Improved Capacity
Micron’s high density, DDR , DDR2, and DDR3 VLP RDIMMs significantly boost overall telecom, networking, and computing blade server memory capacities while remaining compatible with existing RDIMM sockets. These VLP RDIMMs are available in 512MB-to-8GB densities.
Reliability and Compatibility—We employ stringent quality and reliability tests, and we work with chipset vendors to validate our modules.
Features
Benefits
Densities
512MB-8GB
Offers high densities and small form factors to fit server and low-profile
applications—18.29mm (JEDEC) and 17.9mm (ATCA); this enables a 67% reduction
in board space.
Configuration
x72
Offers high densities and small form factors to fit server and low-profile
applications—18.29mm (JEDEC) and 17.9mm (ATCA); this enables a 67% reduction
in board space.
Supply Voltages
1.5V, 1.8V, 2.5V
Reduced power consumption—a key advantage.
Speed Grade
PC-2700-to-PC-10600
333 MT/s to 1333 MT/s for improved speeds.
Temperature Ranges
0°C to +70°C
0°C to +85°C
-40°C to +105°C
Increased operating range for optimum functionality in extreme environments.
Special Features
PLL
Simulation models
Provides better signal integrity to each component on the module.
Our convenient thermal and electrical simulation models are available online
for easy download.
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
TN-00-08
5/2010
258KB
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for
Micron Technology, Inc., products.
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
Please Note: To view Secure Documents () please log in or click on a secured document to request access.
Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
We recently completed our acquisition of Numonyx, bringing together decades of engineering innovation and one of the richest portfolios of memory solutions to give our customers choice and flexibility.
We look forward to the opportunities this acquisition brings. In fact we’re already hard at work to integrate the products, support, and technical information on our Website — so if you’re looking for information or support for Numonyx products, just use the "Navigate Numonyx" tab above.