UDIMM

UDIMM: Price/Performance Balance

Unbuffered DIMMs are the ideal module for high-speed, low-cost computer systems. Our UDIMMs come in SDRAM, DDR, DDR2, and DDR3 solutions and offer data rates as high as 1333 MT/s, and provide parity and ECC capability. They’re an industry standard in high-volume production, offering a great balance of price and performance.

Price and Performance

DDR2-1066 and DDR3-1333: Fast Data Rate Memory
Our DDR2-1066 and DDR3-1333 memory boasts some of the fastest data rates in the business—easily meeting industry demand for increased speeds and improved bandwidth. And because of our manufacturing efficiencies, the DDR2 and DDR3 UDIMMs we build offer some of the most compelling value in the industry today.

UDIMM Part Catalog and Documentation

JEDEC Compatibility
Our UDIMMs are easy to design with, easy to upgrade, and JEDEC compatible. Regardless of which JEDEC UDIMM specification you design to—DDR2 UDIMM Design Specification 1.0 or DDR3 UDIMM Design Specification 0.81, for example—our parts meet it.

Detailed, Specific Tech Support for UDIMMs
We offer multistage technical assistance in the form of savvy application and field engineers; reams of technical notes and data sheets; and abundant simulation models, calculators, and development tools. These resources are here so you can design in a Micron UDIMM with ease.

Extended Temperature Range
Our UDIMMs have a wide operating range, including some solutions that work at temperatures of –40°C to +85°C, helping your application can thrive in rugged environments.

RoHS Options
We provide a full offering RoHS 6/6-compliant UDIMMs. But did you know we also maintain a full set of 5/6-compliant products for industries that have exempt applications so you can get the solutions you need when you need them.

Features	Benefits
Wide Density Range	With many density choices—32MB to 4GB—in a small form factor, you can build powerful devices in a limited amount of space
Optional ECC	Our ECC-enabled UDIMMs seek out and correct single-bit errors for you, boosting data reliability
More RoHS Choices	Both RoHS 6/6 and 5/6 compliant modules
Simulation Models	Our convenient thermal and electrical simulation models are available online for easy download

Title & Description	ID#	Updated	Size
Proper Handling Procedures for Micron DIMMs:		12/2009	406KB
Proper Installation Procedures for Micron DIMMs:		12/2009	430KB
Proper Handling of Micron DIMMs – Japanese:		12/2009	465KB
Proper Installation of Micron DIMMs – Japanese:		12/2009	404KB
Proper Handling of Micron DIMMs – Simplified Chinese:		12/2009	494KB
Proper Installation of Micron DIMMs – Simplified Chinese:		12/2009	607KB
Proper Handling of Micron DIMMs – Spanish:		12/2009	473KB
Proper Installation of Micron DIMMs – Spanish:		12/2009	560KB
Proper Handling of Micron DIMMs – Traditional Chinese:		12/2009	553KB
Proper Installation of Micron DIMMs – Traditional Chinese:		12/2009	777KB
JEDEC Mechanical Dimensions: 184-Pin DIMM		8/1998	309KB
DDR Unbuffered DIMM Design Standard: PC1600/2100 Rev 1.1		12/2009	612KB
UDIMM Raw Card A0: Raw Card A is a single-bank, single-sided PCB for use with x8 DDR SDRAM components		11/2001	1MB
UDIMM Raw card B1: Project: Unbuffered Raw Card B (x8-based dual-bank x64/x72)		11/2001	2MB
UDIMM Raw Card C2: Implemented: Unbuffered Raw Card C2 This release added series stub resistors for the C/A signals and incorporated design changes based on feedback and hardware analysis of Raw Card C		11/2001	2MB
UDIMM Raw Card B0: Note: previous reversion of B1		11/2001	2MB
UDIMM Raw Card C0: Note: previous revision of C1		11/2001	1MB
UDIMM Raw Card C1: Note: previous revision of C2		11/2001	1MB
Bypass Capacitor Selection for High-Speed Designs: Describes bypass capacitor selection for high-speed designs.	TN-00-06	12/2009	490KB
Thermal Applications: Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature	TN-00-08	5/2010	258KB
Recommended Soldering Parameters: Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.	TN-00-15	3/2007	71KB
Uprating of Semiconductors for High-Temperature Applications: Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications	TN-00-18	5/2010	439KB
Understanding Signal Integrity: Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life	TN-00-20	12/2009	2MB
Memory Module Serial Presence-Detect: Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules	TN-04-42	12/2009	518KB
Comparing Module Parameters: Compares module parameters.	TN-04-49	3/2003	54KB
High-Speed DRAM Controller Design: Identifies and discusses five key areas of DRAM controller design	TN-04-54	4/2008	1MB
DRAM Module Form Factors: Compares the most common DRAM module form factors	TN-04-55	9/2009	446KB
Module Part Numbering Systems: Part numbering guides for Micron DDR3, DDR, DDR, and SDRAM modules.		9/2009	41KB
Product Marks/Product and Packaging Labels: Explains product part marking, and product and packaging labels.	CSN-11	2/2010	580KB
PCN/EOL Systems: Explains Micron's product change notification and end-of-life systems.	CSN-12	8/2009	77KB
Shipping Quantities: Provides tables of part quantity.	CSN-04	9/2010	753KB
Micron Component and Module Packaging: Explanation of Micron packaging labels and procedures.	CSN-16	3/2010	833KB
ESD Precautions for Die/Wafer Handling and Assembly: Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.	CSN-24	8/2010	122KB
Electronic Data Interchange: Describes EDI transmission sets, protocol, and contacts.	CSN-06	9/2005	55KB
RMA Procedures for Packaged Product and Bare Die Devices: Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.	CSN-07	8/2004	52KB
Environmental Programs: Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.	CSN-05	6/2004	55KB
ISO System Management Standards: Describes ISO system management standards.	CSN-08	4/2004	40KB
Competitive DDR Memory Subsystems: DDR milestones and platform design		12/2009	3MB
DDR System Design Considerations: DDR overview		12/2009	4MB
The Future of Memory and Storage: Overview of trends for main memory and Flash memory		12/2009	2MB
Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture	TN-00-01	2/2010	89KB
Avoid Counterfeit Products: Highlights Micron-guaranteed products and how to buy genuine Micron products.		3/2010	201KB

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Can Vtt and Vref be supplied by the same supply in my system design?: With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?: No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.

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UDIMM

UDIMM: Price/Performance Balance

Price and Performance

UDIMM Part Catalog and Documentation

ON-LINE NONDISCLOSURE AGREEMENT

ON-LINE NONDISCLOSURE AGREEMENT

UDIMM

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