Our small-outline registered DIMMs (SORDIMMs) provide data reliability through reduced address, command, control, and clock signal loading; temperature monitoring--all in a narrow form factor.
Built for Networking and Communications
We’ve developed our SORDIMMs with the networking and communications industries
in mind. We understand that these applications demand low latency, small memory
footprints, pristine signal integrity, and stringent thermal specifications.
And our SORDIMMs deliver--the right specifications and great reliability in
a compact form factor.
Focused on Reliability
Our SORDIMMs are some of most reliable networking modules available--designed
as mission-critical solutions. These modules use reduced address, command, control,
and clock-signal loading to improve signal integrity. Next, our SORDIMMs include
onboard temperature monitoring that provides real-time temperature measurement
and warnings to avoid temperature-related failures
Impeccable Quality
We manage module manufacturing from beginning to end, designing in best-in-class
DRAM components and working with board makers to ensure compatibility. We carefully
test components, packaging, and the modules during the entire manufacturing
process, and that involvement at every stage of memory development and manufacture
ensures you'll consistently receive some of the best quality SORDIMM modules
possible.
Features
Benefits
Wide Density Range
With densities from 512MB to 4GB, Micron’s SORDIMMs offer high density in a small form factor for space-limited designs
Flexible Configuration
Available with ECC and single- or dual-rank support
PLL
Provides better signal integrity to each component on the module
Buffered clock, command, and address signals
Reduces the load on the memory controller, which ensures signal integrity and enables the system to accommodate the maximum number of modules
Simulation Models
Our convenient thermal and electrical simulation models are available online for easy download
Temperature Sensor
Takes real-time temperature measurements and provides warnings to prevent temperature-related failures
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
TN-00-08
5/2010
258KB
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for
Micron Technology, Inc., products.
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
We recently completed our acquisition of Numonyx, bringing together decades of engineering innovation and one of the richest portfolios of memory solutions to give our customers choice and flexibility.
We look forward to the opportunities this acquisition brings. In fact we’re already hard at work to integrate the products, support, and technical information on our Website — so if you’re looking for information or support for Numonyx products, just use the "Navigate Numonyx" tab above.
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