SODIMM: Notebook, Netbook, Mobile Internet Device Memory Module
With densities of up to 4GB and data rates as high as 1333 MT/s, our small-outline DIMMs (SODIMMs) are an excellent choice for space-limited computing designs, including netbooks and mobile internet devices.
Smaller Form Factor Saves Board Space
SODIMMs were specifically designed to fit in slim notebook PCs and mobile internet devices. Although a typical SODIMM is approximately 30mm high, just like a standard module, it is significantly shorter—saving board space when you need it.
Intel-Certified, Motherboard-Tested DDR3 Memory
We work with motherboard manufacturers to validate our SODIMMs and support a wide array of mobile computing platforms. In particular, Intel has certified us to run qualification tests for Intel-based motherboards, ensuring that a Micron memory solution like our DDR3 SODIMMs will work with the motherboard you select. These tests match Intel’s Full & Basic Functional Test Procedures.
What you’ll learn from these tests is simple. Our DDR3 SODIMMs are dense, fast, and power thrifty. They’re based on our market-leading DDR3 process technology, including our 6F² array architecture that slices die sizes by at least 20%. And they’re validated with virtually every leading board maker.
Our design support separates us from the competition. We start with detailed data sheets and technical notes. Some of these recent documents have been developed using the Darwin Information Type Architecture and the latest XML-based authoring technology, so you get what could be the most current and accurate documentation possible in the semiconductor business. We also provide time saving simulation models and development tools, and we have some of the industry’s smartest field applications engineers. These resources are here to help you design with ease.
Dependable Quality
We build memory modules from start to finish—beginning with memory component design—carefully testing at each stage of the manufacturing process. We work with board makers and industry organizations to define and develop the leading technologies. Our involvement at every stage of memory development and manufacture means you'll consistently receive top-quality modules.
Features
Benefits
High Density
64MB–4GB provides high density in a small form factor for space-limited designs
Flexible Configuration
Available with ECC (on DDR modules) and single- or dual-rank support
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
TN-00-08
5/2010
258KB
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for
Micron Technology, Inc., products.
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
We recently completed our acquisition of Numonyx, bringing together decades of engineering innovation and one of the richest portfolios of memory solutions to give our customers choice and flexibility.
We look forward to the opportunities this acquisition brings. In fact we’re already hard at work to integrate the products, support, and technical information on our Website — so if you’re looking for information or support for Numonyx products, just use the "Navigate Numonyx" tab above.
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