The unique requirements—pristine signal integrity and rigorous footprint specifications—of communications and networking applications demand specialty memory. Micron's ultra-narrow small-outline clocked DIMMs (SOCDIMMs) are the perfect solution for platforms that require small form factors, such as Advanced Telecom Computing Architecture® (AdvancedTCA®) and µTCA (microTCA). Just 67.75mm long, these modules provide several distinct advantages over their unbuffered counterparts.
With their high clock frequencies (200-400 MHz), SOCDIMMs—SODIMMs with clock—improve speed while the phase-lock loop (PLL) chip provides better signal integrity, improving signal timing and reducing system loading. All these SOCDIMM features provide increased speed and data reliability for networking systems in the ultra-narrow SODIMM form factor.
Micron has the solutions to meet the needs of networking from the core to the edge to the premise. Let Micron's products make finding the right specialty solution easy.
Features
Benefits
Densities
256MB-2GB
Offers high density and a small form factor for space-limited designs.
Configuration
x72
Features ECC and single or dual rank support.
Clock Frequency
200 MHz-400 MHz
400-800 MT/s for improved speeds.
Supply Voltages
1.7V-1.9V 3.0V-3.6V
VDD power VDD SPD power
Temperature Ranges
0°C to +85°C
Increased operating range for optimum functionality in extreme environments.
Special Features
PLL
TEMP Sensor
Simulation Models
Connector
Provides better signal integrity to each component on the module. Provides real-time temperature measurements with alarm output. Provides designer the ability to simulate the whole system. Provides a way to support high densities using right angle socket.
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
TN-00-08
5/2010
258KB
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for
Micron Technology, Inc., products.
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
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