RDIMM

Memory for the Global Infrastructure

Registered DIMMs are a mainstream memory module solution that powers thousands of successful designs worldwide

RDIMM Innovation for Many Applications

Industry-Leading Reliability
Our RDIMMs are built with what may be the industry’s most reliable memory components. RDIMM features like registers, buffers, and ECC help ensure data integrity at both the device and the system level.

RDIMM Part Catalogs and Documentation

Dozens of Density Options
Because our RDIMMs represent the mainstream of module production and development, we can offer them in an extremely wide range of densities, from 128MB to 16GB.

Extended Temperature Range
Our RDIMMs have a wide operating range, including some that work at temperatures of 0°C to +95°C, helping your application can thrive in rugged environments.

RoHS Options
Of course we offer RoHS 6/6-compliant RDIMMs; but did you know we also maintain a full set of 5/6-compliant products for industries that have exempt applications to providing the solutions you need when you need them.

Sim Models and Other Online Design Support
As a Micron customer, you have access to some of the industry’s most experienced field applications engineers, but we also offer a host of time-saving support tools free online, including:

Easy-to-use data sheets
Detailed technical notes
Simulation models
Online development tools (like SPD data tables)

Our thermal and electrical sim models let you validate module options to see what works best for your design. And because our data sheets are built on the latest XML-based authoring technology, we can deliver some of the most timely and accurate documentation in the semiconductor business. See specific module part pages for individual documents and tools.

Learn more

Dependable Quality
We build memory modules from start to finish—beginning with memory component design—carefully testing at each stage of the manufacturing process. We work with board makers and industry organizations to define and develop the leading technologies. Our involvement at every stage of memory development and manufacture means you'll consistently receive top-quality modules.

Features	Benefits
Wide Density Range	128MB–16GB
Flexible Configuration	Available single- or dual-rank support
PLL	Provides better signal integrity to each component on the module
Simulation Models	Our convenient thermal and electrical simulation models are available online for easy download

Title & Description	ID#	Updated	Size
Proper Handling Procedures for Micron DIMMs:		12/2009	406KB
Proper Installation Procedures for Micron DIMMs:		12/2009	430KB
Proper Handling of Micron DIMMs – Japanese:		12/2009	465KB
Proper Installation of Micron DIMMs – Japanese:		12/2009	404KB
Proper Handling of Micron DIMMs – Simplified Chinese:		12/2009	494KB
Proper Installation of Micron DIMMs – Simplified Chinese:		12/2009	607KB
Proper Handling of Micron DIMMs – Spanish:		12/2009	473KB
Proper Installation of Micron DIMMs – Spanish:		12/2009	560KB
Proper Handling of Micron DIMMs – Traditional Chinese:		12/2009	553KB
Proper Installation of Micron DIMMs – Traditional Chinese:		12/2009	777KB
DDR Registered DIMM Design Standard: PC1600/2100 Rev 1.2		12/2009	550KB
JEDEC Mechanical Dimensions: 184-Pin DIMM		8/1998	309KB
Bypass Capacitor Selection for High-Speed Designs: Describes bypass capacitor selection for high-speed designs.	TN-00-06	12/2009	490KB
Thermal Applications: Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature	TN-00-08	5/2010	258KB
Recommended Soldering Parameters: Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.	TN-00-15	3/2007	71KB
Uprating of Semiconductors for High-Temperature Applications: Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications	TN-00-18	5/2010	439KB
Understanding Signal Integrity: Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life	TN-00-20	12/2009	2MB
Memory Module Serial Presence-Detect: Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules	TN-04-42	12/2009	518KB
Comparing Module Parameters: Compares module parameters.	TN-04-49	3/2003	54KB
High-Speed DRAM Controller Design: Identifies and discusses five key areas of DRAM controller design	TN-04-54	4/2008	1MB
DRAM Module Form Factors: Compares the most common DRAM module form factors	TN-04-55	9/2009	446KB
Module Part Numbering Systems: Part numbering guides for Micron DDR3, DDR, DDR, and SDRAM modules.		9/2009	41KB
Product Marks/Product and Packaging Labels: Explains product part marking, and product and packaging labels.	CSN-11	2/2010	580KB
PCN/EOL Systems: Explains Micron's product change notification and end-of-life systems.	CSN-12	8/2009	77KB
Shipping Quantities: Provides tables of part quantity.	CSN-04	3/2010	515KB
Micron Component and Module Packaging: Explanation of Micron packaging labels and procedures.	CSN-16	3/2010	833KB
ESD Precautions for Die/Wafer Handling and Assembly: Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.	CSN-24	8/2010	122KB
Electronic Data Interchange: Describes EDI transmission sets, protocol, and contacts.	CSN-06	9/2005	55KB
RMA Procedures for Packaged Product and Bare Die Devices: Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.	CSN-07	8/2004	52KB
Environmental Programs: Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.	CSN-05	6/2004	55KB
ISO System Management Standards: Describes ISO system management standards.	CSN-08	4/2004	40KB
Competitive DDR Memory Subsystems: DDR milestones and platform design		12/2009	3MB
DDR System Design Considerations: DDR overview		12/2009	4MB
The Future of Memory and Storage: Overview of trends for main memory and Flash memory		12/2009	2MB
Moisture Absorption in Plastic Packages: Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture	TN-00-01	2/2010	89KB
Avoid Counterfeit Products: Highlights Micron-guaranteed products and how to buy genuine Micron products.		3/2010	201KB

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Can Vtt and Vref be supplied by the same supply in my system design?: With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?: No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.

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RDIMM

Memory for the Global Infrastructure

RDIMM Innovation for Many Applications

RDIMM Part Catalogs and Documentation

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ON-LINE NONDISCLOSURE AGREEMENT

RDIMM

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