Managing the Challenges of Server Speed and Density
Speed and Scalability
Our FBDIMM technology solves server challenges for you—and for your customers. Our high-speed, high-density FBDIMMs can give you virtually unlimited scalability of density and high-bandwidth solutions, all with an extremely reliable channel protocol.
How do we do it? At the core of FBDIMM architecture is an advanced memory buffer (AMB), which provides an interface from the DRAM through the high-speed information channel. Our FBDIMM technology uses DDR2 memory with a different topology, and this high-speed, point-to-point interface rapidly transmits signals among the controller, memory devices, and other modules, enabling simultaneous task performance (and eliminating additional dead time), while reducing soft errors.
With data rates as high as 4.8 Gb/s, our FBDIMMs enable extremely fast buffering—optimizing
server performance, limiting data inaccuracies, avoiding crashes, and improving
overall reliability. These modules are available in 512MB to 8GB configurations
and can be scaled to meet almost any server challenge.
Advanced Memory Buffer
The AMB maintains signal integrity and improves error detection methods, reducing soft errors. This simplified structure gives FBDIMMs a lower pin count and faster transmission rates than conventional architectures. Plus, they can perform reads and writes simultaneously, eliminating the read-to-read delay between data transfers. With speeds up to 4.8 Gb/s, our FBDIMMs enable fast buffering to optimize server performance.
Improved Error Detection
Our FBDIMMs incorporate an enhanced cyclic redundancy check (CRC) that provides greater data and address/command protection than traditional server modules. You can also configure the CRC to suit your application.
Other Key Benefits
Extended Memory Capacity
High-density solutions for extended memory capacity.
Reliability and Compatibility
We use stringent quality and reliability tests and work with chipset vendors to validate our modules to ensure you get high-quality parts.
Extended Temperature Range
An extended temperature range provides optimum performance and proven reliability in rugged environments.
Features
Benefits
Densities
512MB to 8GB
Wide range of densities supports moderate to high-density applications; eliminates memory capacity limits
Configuration
x72
Various ECC algorithms supported with FBDIMM protocol; improved error detection dramatically reduces soft errors
Supply Voltages
1.5V 1.55 1.8V
Multiple voltages enable flexibility for designs
Clock Frequencies
PC2-5300 to PC2-6400
Supports DRAM data rates of 667 and 800 MT/s
Temperature Ranges
0°C to +95°C
Increased operating range for optimum functionality in extreme environments
Special Features
Advanced memory buffer (AMB)
Buffers all signals to and from DRAM, which increases system capacity; provides high-speed serial interface between memory controller and AMB; uses traditional DRAM interface between AMB and conventional DRAM; newly advanced channel features vastly improve performance
Fully Buffered DIMM Flyer:
Describes how FBDIMMs unleash server capacity by removing the density/performance tradeoff of traditional stub-bus architectures
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
TN-00-08
5/2010
258KB
Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for
Micron Technology, Inc., products.
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
FBDIMM – Channel Utilization (Bandwidth and Power):
Newly introduced FBDIMMs offer virtually unlimited scalability of density, a significantly reduced number of routed motherboard signals, and high bandwidth solutions, all with an extremely reliable channel protocol
Driving Down Power Consumption in Data Centers:
A success story about how Egenera increased the energy efficiency of its data center virtualization systems by designing in Micron's low-voltage memory.
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
Please Note: To view Secure Documents () please log in or click on a secured document to request access.
Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
We recently completed our acquisition of Numonyx, bringing together decades of engineering innovation and one of the richest portfolios of memory solutions to give our customers choice and flexibility.
We look forward to the opportunities this acquisition brings. In fact we’re already hard at work to integrate the products, support, and technical information on our Website — so if you’re looking for information or support for Numonyx products, just use the "Navigate Numonyx" tab above.
) please