We have one of the broadest SDRAM offerings in the industry. Several densities;
extended operating temperatures; and various clock rates, cycle times, and package
types make it easy to get just what you need—it’s a relatively simple, cost-effective,
and easy-to-implement memory option for both new and existing designs.
Why complicate your design? If a simple, cost-effective SDRAM solution will
do, plug it in and go. You already know it’s a reliable part. You know
it’s got all the features you’re looking for. Plus it’s a
solid long-term solution. We have plans to support it for years to come so it’s
still a good fit for products with long life cycles.
Our 3.3V SDRAM family offers plenty of options. In fact, we have one of the broadest offerings in the industry today. Choose from multiple densities, extended operating temperatures, and various clock rates, cycle times, and package types to get just what you need.
Stable Supply
Stability, flexibility, and availability are all characteristics that describe
an ideal long-term memory solution. Our SDRAM memory is that kind of solution—the
kind you need for the long haul to support your established, proven products.
And not only do we have the solutions you need, we’ll help you make the
best use of the technology. See our SDRAM part catalog for a complete list.
Technical Support
With Micron, you get great memory, backed by experienced technical support—from
comprehensive data sheets to time-saving simulation models. We have the FAEs
and design development tools to make your job easier. You can dive into our
technical resources on a do-it-yourself design or work with one of our local
field applications engineers if your mass-market project presents a unique challenge.
Whatever you need to get your design to market faster, easier, and better—we
want to deliver it.
Specification
Description
Densities
64Mb, 128Mb, 256Mb, 512Mb
Configurations
x4, x8, x16, x32
Supply Voltage
3.3V
Clock Frequencies
133–200 MHz
Temperature Ranges
0° to +70°C
-40°C to +85°C
-40°C to +105°C**
Packages
54- and 60-ball FBGA
54- and 90-ball VFBGA
54- and 86-pin TSOP
IBIS Behavioral Models:
Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
TN-00-07
11/2009
168KB
Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
TN-00-20
12/2009
2MB
SEMI Wafer Map Format:
Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI®). With SEMI formatting, Micron’s customers can be confident they will always receive consistent, compatible, reliable map files.
Backward Compatibility for Faster SDRAM:
Reviews the timing differences between SDRAM generations and shows how the faster Micron parts are compatible with the slower parts
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved
quality and reliability, resulting in reduced manufacturing costs.
Environmental Programs:
Describes the environmental programs at Micron, including air quality, pollution prevention, reclamation and reuse, and waste recycling and reduction.
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Can CKE be tied HIGH throughout SDRAM operation (initialization and normal operation)?
JEDEC does not specify the exact state of CKE during initialization; it is supplier specific. Micron strongly recommends CKE be kept at an LVTTL logic LOW before applying a stable CLK signal. During normal operation, CKE can be tied HIGH. The initial LOW state of CKE prevents parts from receiving an illegal LMR command, which could put the part into an unknown or unexpected state.
Can the SDRAM clock frequency be changed?
Micron SDRAM data sheets require that the clock frequency be constant during access or precharge states (READ, WRITE, tWR, and PRECHARGE commands). At other times frequency should not matter much because there is no DLL in SDRAM however, we do not recommend it. Lowering SDRAM frequency is OK even if you are not doing an LMR and CAS latency change. In case of increasing frequency, ensure tCK and CAS latency specifications are met. In either case, all other data sheet timing specifications should be adhered to.
Is there a recommended lowest working frequency for SDRAM?
Because SDRAM does not have a DLL, there is no recommended lowest frequency. SDRAM parts will work at very low frequencies if all data sheet specifications are met. It is important to maintain a good slew rate, however, since a very slow slew rate will affect setup and hold-time transitions. Also, for operating frequencies of 45 MHz, tCKS = 3.0ns. For more information, see TN-48-09.
We recently completed our acquisition of Numonyx, bringing together decades of engineering innovation and one of the richest portfolios of memory solutions to give our customers choice and flexibility.
We look forward to the opportunities this acquisition brings. In fact we’re already hard at work to integrate the products, support, and technical information on our Website — so if you’re looking for information or support for Numonyx products, just use the "Navigate Numonyx" tab above.
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