Optimizing Performance in Low-Power Applications
The number of designs requiring low-power memory has taken off in the last several years. And across the board—from mobile and automotive, to industrial and networking applications—consumers are demanding more features and functionality. And you're being expected to design it all in with less money, less time, and less space. For those kinds of design challenges, we offer a wide range of Mobile DRAM devices.
We have the low power consumption, high performance, and wide temperature ranges you need to give your customers greater mobility and longer battery life. Take advantage of the low 1.8V power supply to reduce power consumption, and the 1.2V I/O option available on some devices to improve signaling for high-speed, high-bandwidth operation. You can also achieve data transfer rates of 400 Mb/s with parts that deliver clock speeds up to 200 MHz. And, if you’re looking for parts that can withstand rugged environments, count on ours to perform at operating temperatures as wide as –40°C to +105°C.
Micron's low-power Mobile DRAM is also available as Known Good Die.
Mobile DRAM Part Catalogs and Documentation
Design In the Fastest Mobile DRAM
The 512Mb Mobile DDR SDRAM is the first to deliver maximum clock speeds of 200 MHz, enabling rip-roaring transfer speeds of 400 Mb/s. It's also a low-power part with a 1.2V I/O option, so there are no worries about bogging down performance or burning up a battery. Find out what this product introduction could mean for your feature-rich design.
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A low 1.8V power supply—together with features like TCSR, PASR, and DPD—delivers significant power savings to battery-operated systems.
Automotive and other applications that operate in extreme environments can benefit from the extended –40°C to +105°C and industrial –40°C to +85°C temperature ranges these products offer.
Mobile DRAM Features and Benefits
| | Features | Benefits |
| Densities |
64Mb–512Mb (SDR)
128Mb–1Gb (DDR)
|
Provides flexibility for a variety of application designs |
| Configurations |
x16 and x32 |
Enables the use of fewer components to support wide-bus architectures |
| Voltage |
1.8V |
Helps reduce power consumption—a key advantage over standard DRAM |
| Clock Frequencies |
Up to 166 MHz (SDR)
Up to 200 MHz (DDR) |
Provides performance comparable to SDR and DDR SDRAM, with the added advantage of power savings |
| Power Consumption |
Refer to specific data sheet |
Delivers low power dissipation in standby and active modes, plus special mobile features to reduce power consumption for a more efficient design |
| Special Features |
Temperature-compensated self refresh (TCSR) |
Adjusts refresh timing to minimize power consumption at lower, ambient temperatures |
| Partial-array self refresh (PASR) |
Eliminates unnecessary row activations; refreshes 1/1, 1/2, 1/4, 1/8, 1/16 array |
| Deep-power down (DPD) |
Provides a low power state when data retention is not required |
| Programmable Drive Strength (DS) |
Allows for drive currents to be reduced in point-to-point applications; easily adjusts to full, half, quarter, or eighth, based on memory bus loading |
| Temperature Ranges |
0˚C to +85˚C
–40˚C to +85˚C
–40˚C to +105˚C
|
Enables high performance in extreme environments |
| Packages |
VFBGA |
Reduces footprint by up to 40% relative to standard SDR and DDR SDRAM for a smaller, more compact design; supports JEDEC-standard VFBGA pinout |
| Known Good Die |
Supports bare die with edge bond pads for easy stacking in SIP and MCP solutions |
| DRAM-only PoP |
Saves board space by allowing a DRAM to be stacked on top of a processor so that the two components require only one footprint on the board; contact factory for DRAM-only PoP availability |
6 Advantages of Designing with Mobile DRAM
Low Power
Standard 1.8V I/O power supply enables low standby current and low self refresh, which extends battery life.
High Performance
The industry’s fastest Mobile DRAM delivers max clock speeds up to 200 MHz, enabling data transfer rates of 400 Mb/s.
Temperature Ranges
Extended temperature ranges enable high performance in extreme environments.
Product Breadth
A range of densities and packages enhances design flexibility and provides a migration path.
Testing and Reliability
Our Quality and Assurance Department ensures our parts undergo stringent quality and reliability testing.
Technical and Regional Support
Our design engineers have the expertise to help with your unique design challenges.
Why Buy Micron?
- Technology Leader
Micron's manufacturing efficiencies, cutting-edge innovations, and leading patent portfolio lead the industry in technological excellence.
- Product Breadth
With a full line of DRAM components, modules, and NAND Flash products, we have the right device for your design.
- Technical Support
Micron's engineering and technical assistance can provide the competitive advantage you need to get your designs to market faster.
- Quality Products
Stringent quality and reliability testing makes our devices stand out as some of the highest-quality parts in the industry.
- Customer Commitment
We work closely with other vendors, manufacturers, and enablers to help you deliver a complete, proven solution.
- Environmental Certification
All devices are available in Pb-free versions, and many offer the added environmental protection of "green" packaging.