UDIMM

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UDIMM: Price/Performance Balance

Unbuffered DIMMs are the ideal module for high-speed, low-cost computer systems. Our UDIMMs come in SDRAM, DDR, DDR2, and DDR3 solutions and offer data rates as high as 1333 MT/s, and provide parity and ECC capability. They’re an industry standard in high-volume production, offering a great balance of price and performance.

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Price and Performance

DDR2-1066 and DDR3-1333: Fast Data Rate Memory
Our DDR2-1066 and DDR3-1333 memory boasts some of the fastest data rates in the business—easily meeting industry demand for increased speeds and improved bandwidth. And because of our manufacturing efficiencies, the DDR2 and DDR3 UDIMMs we build offer some of the most compelling value in the industry today.

UDIMM Part Catalog and Documentation

JEDEC Compatibility
Our UDIMMs are easy to design with, easy to upgrade, and JEDEC compatible. Regardless of which JEDEC UDIMM specification you design to—DDR2 UDIMM Design Specification 1.0 or DDR3 UDIMM Design Specification 0.81, for example—our parts meet it.

Detailed, Specific Tech Support for UDIMMs
We offer multistage technical assistance in the form of savvy application and field engineers; reams of technical notes and data sheets; and abundant simulation models, calculators, and development tools. These resources are here so you can design in a Micron UDIMM with ease.

Extended Temperature Range
Our UDIMMs have a wide operating range, including some solutions that work at temperatures of –40°C to +85°C, helping your application can thrive in rugged environments.

RoHS Options
We provide a full offering RoHS 6/6-compliant UDIMMs. But did you know we also maintain a full set of 5/6-compliant products for industries that have exempt applications so you can get the solutions you need when you need them.

Features Benefits
Wide Density Range With many density choices—32MB to 4GB—in a small form factor, you can build powerful devices in a limited amount of space
Optional ECC Our ECC-enabled UDIMMs seek out and correct single-bit errors for you, boosting data reliability
More RoHS Choices Both RoHS 6/6 and 5/6 compliant modules
Simulation Models Our convenient thermal and electrical simulation models are available online for easy download

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
Memory Module Serial Presence-Detect:  Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 505.83 KB
Comparing Module Parameters:  Compares module parameters. TN-04-49 03/2003 52.71 KB
High-Speed DRAM Controller Design:  Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 1 MB
DRAM Module Form Factors:  Compares the most common DRAM module form factors TN-04-55 09/2009 435.56 KB
Module Part Numbering Systems:  Part numbering guides for Micron DDR3, DDR, DDR, and SDRAM modules. 02/2012 41.77 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 08/2009 75.58 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 10/2011 463.55 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 840.61 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Competitive DDR Memory Subsystems:  DDR milestones and platform design 12/2009 2.64 MB
DDR System Design Considerations:  DDR overview 12/2009 3.46 MB
The Future of Memory and Storage:  Overview of trends for main memory and Flash memory 12/2009 1.54 MB
Design Guide for Two DDR3-1066 UDIMM Systems:  Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 1.1 MB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Proper Handling Procedures for Micron DIMMs:  12/2009 396.18 KB
Proper Installation Procedures for Micron DIMMs:  12/2009 419.89 KB
Proper Handling of Micron DIMMs - Japanese:  12/2009 453.96 KB
Proper Installation of Micron DIMMs - Japanese:  12/2009 394.2 KB
Proper Handling of Micron DIMMs - Simplified Chinese:  12/2009 482.47 KB
Proper Installation of Micron DIMMs - Simplified Chinese:  12/2009 592.58 KB
Proper Handling of Micron DIMMs - Spanish:  12/2009 461.82 KB
Proper Installation of Micron DIMMs - Spanish:  12/2009 546.81 KB
Proper Handling of Micron DIMMs - Traditional Chinese:  12/2009 539.92 KB
Proper Installation of Micron DIMMs - Traditional Chinese:  12/2009 758.93 KB
JEDEC Mechanical Dimensions:  184-Pin DIMM 08/1998 301.7 KB
DDR Unbuffered DIMM Design Standard:  PC1600/2100 Rev 1.1 12/2009 597.36 KB
UDIMM Raw Card A0:  Raw Card A is a single-bank, single-sided PCB for use with x8 DDR SDRAM components 11/2001 1.29 MB
UDIMM Raw card B1:  Project: Unbuffered Raw Card B (x8-based dual-bank x64/x72) 11/2001 1.85 MB
UDIMM Raw Card C2:  Implemented: Unbuffered Raw Card C2 This release added series stub resistors for the C/A signals and incorporated design changes based on feedback and hardware analysis of Raw Card C 11/2001 1.55 MB
UDIMM Raw Card B0:  Note: previous reversion of B1 11/2001 1.62 MB
UDIMM Raw Card C0:  Note: previous revision of C1 11/2001 1.07 MB
UDIMM Raw Card C1:  Note: previous revision of C2 11/2001 1.16 MB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 02/2012 666.83 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB

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Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.

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