Micron's Osmium packaging technology, which borrows its name from one of the densest natural elements known to mankind, is poised to drive semiconductor packaging to the wafer level.
Conventional packaging methods are reaching their technological limits, and electronics manufacturers are still demanding smaller, denser packages, improved performance, and lower system costs. Micron's Osmium packaging technology, with its potential to deliver extremely high-density, small-form-factor solutions, is the right technology at the right time.
Osmium technology combines through-wafer interconnects, a redistribution layer, and wafer-level encapsulation—along with hundreds of supporting US patents and process engineering breakthroughs—and effectively extends the fabrication process to finished goods. This unique blend of leading wafer-level packaging technologies and IP promises to change the dynamics of semiconductor manufacturing and set a new standard for semiconductor packaging.
Micron is actively engaged in elevating Osmium technology from an innovative idea to a groundbreaking technological achievement. For more information on how this packaging technology can enhance the competitiveness of your products, see our 
Osmium Packaging Technology booklet.
Through-Wafer Interconnects
Conductive material is used to fill a small hole
drilled directly through the die bond pad, enabling
die to be stacked on top of one another.
Redistribution Layer
Pad ballouts can be redistributed from the
die bond pad to meet standard or custom
ballout patterns.
Wafer-Level Encapsulation
Individual die are encapsulated in epoxy
on all sides while still part of the wafer.